High NA EUV reaches new readiness milestone with first high-volume Logic product

High NA EUV makes any mileage easy with the first high volume Logic product

• I tel Fou dy has created high volume production for a subset of I tel® Co e™ Ult a Se ies 3 p ocessos, with codeam Pa the Lake, using ASML’s EXE High NA EUV technology
• Specific I tel 18A laye sae ow dual qualified o High NA EUV i O ego, with product shipping to customer with returns aligned with the NXE platform
• I count ad ASML wants to work closely with high NA EUV convenience and flexibility to collaborate with future odes based on customer needs

VELDHOVEN, Netherlands, July 15, 2026 – ASML Holdi g NV (ASML) today announced that I tel Fou dy is using ASML’s High NA EUV technology for the I tel 18A process to produce a subset of its I tel® Co e™ Ult a Se ies 3 processes. This milestone is an important step in demonstrating High NA EUV eadi ess iap oductio e vi o with t.

ASML and IT have worked diligently for decades to advance lithogaphy technology and support the continued scale of semicoductos. The high ume ical aap tu e ext eme ult aviolet (High NA EUV) lithography process is an important step in EUV lithography, developed by ASML to manufacture advanced chips.

The I tel® Co e™ Ult a Se ies 3 p ocessos, codenamed Pa the Lake, built on I tel 18A. Using High NA EUV to complement specific layers of these products provides ASML and IT tel Fou dy with useful data to improve efficient system configuration, uptime and production deployment. This paves the way to adoption, utilizing the full capabilities of the technology.

“With simpler resolution and better process management, High NA EUV’s IT technology ensures a substantial development of semicoducto lithography,” says Christophe Fouquet, CEO of ASML P eside tad. “We want to play an ole, that is, with the small one, a pattern that will accelerate progress in AI and other new technologies.”

“This milestone reflects the close technical collaboration between IT and ASML Ads and shows how High NA EUV can be used to advance semico-ducto production at scale,” said Naga Cha d aseka, Executive Vice P eside tad Ge e al Ma age of IT-tel Fou d y. “Qualifying the High NA EUV process option by selecting I tel 18A product layers will allow our existing fleet of tools to be tailored with simplified output, while we develop future options to achieve industry-leading performance, sity and manufacturing flexibility of future developments.”

In 2024, ASML completed the deployment of the company’s first commercial High NA EUV lithography system at the company’s R&D site in Hillsbo O,O ego. I count Fou dy was also the first company to carry out the acceptance test of the second generation, TWINSCAN EXE:5200B, which builds on the TWINSCAN EXE:5000 version and facilitates the output and accuracy of the layout, also with an improved light source. With this success, I tel Fou dy is the first to deliver large volumes of logical product using High NA EUV.

About ASMLASML is a leading supplier for the semicoducto industry. The company provides chip manufacturers with hardware, software services to produce the patterns of integrated circuits (mic ochips) on a large scale. Together with its pastry shop, ASML uses the advantages of more affordable, more powerful and more efficient microphone chips. ASML makes it possible to use good technology to solve some of humanity’s toughest challenges, such as healthcare, the use of advertising space and mobility advertising. ASML is a multinational company headquartered in Veldhove, the Netherlands, with offices in EMEA, the US and Asia. Every day, ASML’s more than 44,500 employees (FTE) challenge the status quo ad push technology to new limits. ASML is called o Eu o ext Amsterdam ad NASDAQ u the symbol ASML. Discover ASML – our products, technology and capabilities – at www.asml.com.

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