ACM Research Delivered Its First High-Throughput Ultra Lith KrF Track System to a Leading Chinese Logic Wafer Fab Customer

New Ultralith _Krf Track system delivers high-throughput performance with patented platform design and stimulates advanced process control for adult lithography applications

Fremont, California, September 7, 2025 (Globe Newswire) – ACM Research, Inc. ) _Krf Track system, designed to support the production of front-end semiconductor. The new system is expanding the product line of ACM lithography and delivers high-throughput performance, advanced thermal control and real-time process control and monitoring. The first system was sent in September 2025 to a leading Chinese Logic Wafer FAB customer.

ACM’s Ultra Lith _Krf Track system builds on the proven architecture and process performance of the ACM Arf track platform, which successfully completed the demo-line process verification with a leading Chinese customer at the end of 2024. This system demonstrated sub-anxo-level coating uniformity, advanced thermal control and ASML scanner-outlined CD-Matching capabilities for designing the KRF platform in the KRF platform.

“The launch of ACM’s Ultra Lith _Krf Track system expands the presence of ACM in front-end process equipment and reflects our dedication to tackle a wider range of lithography challenges, “said Dr. David Wang, President and Chief Executive Officer of ACM.” KRF lithography remains essential for adults, of which ACM believes it is a large and growing part of the global semiconductor output. By offering both ARF and KRF track systems, ACM makes seamless FAB integration and greater flexibility of production possible in various applications. “

ACM’s Ultra Lith _Krf Track system has a flexible process module configuration, including 12 spin coaters and 12 developers (12C12D), supported by 54 hot plates that are capable of low, medium and high temperature processing with leading thermal uniformity. The system reaches transit larger than 300 waffles per hour (WPH) and contains ACM’s own back -side particle removal unit (BPRV) technology to minimize the risk of cross -contamination. In addition, the Integrated Wafer Scale Outsor Inspection (WSOI) Unit Real-Time Process Variation Detection and Return Disability Monitoring makes improving process stability and production efficiency.

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About ACM Research, Inc.

ACM develops, produces and sells semiconductor process equipment that cleansing, electropatization, stress-free polishing, vertical oven processes, track, PECVD and waffle and panel level Packaging tools, advanced and semi-critical semiconductor device production, produces and sells protection. ACM strives to deliver adapted, powerful, cost -effective process solutions that manufacturers of semiconductors can use in numerous production steps to improve productivity and product yield. For more information, visit http://www.acmr.com.

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